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| DISCRETE POWER AND SIGNAL TECHNOLOGIES BAV23S HIGH VOLTAGE GENERAL PURPOSE DIODE PD . . . .350 mW @ TA = 25 Deg C BV . . . .250 V (MIN) @ IR = 100 uA TRR . . . 50 nS @ IF=IR = 30 mA IRR = 3.0 mA ABSOLUTE MAXIMUM RATINGS (NOTE 1) TEMPERATURES Storage Temperature Operating Junction Temperature POWER DISSIPATION (NOTES 2 & 3) Total Device Dissipation at TA = 25 Deg C Derating Factor per Degree C VOLTAGES & CURRENTS VRRM Repetitive Peak Reverse Voltage (Single Device) VRRM Repetitive Peak Reverse Voltage (Series Connection) VRWM Continuous Peak Reverse Voltage (Single Device) VRWM Continuous Peak Reverse Voltage (Series Connection) IO Average Rectified Current IF DC Forward Current if Recurrent Peak Forward Current if (surge) Peak Forward Surge Current Pulse Width = 1.0 microsec Pulse Width = 100 microsec Pulse Width = 10 millisec 150 Degrees C 150 Degrees C 350 mW 2.8 mW 250 V 500 V 200 V 400 V 200 mA 400 mA 700 mA 9.0 A 3.0 A 1.7 A 1 3 L30 1 2 PACKAGE TO-236AB (Low) (SOT-23) CONNECTION DIAGRAMS 3 2 ELECTRICAL CHARACTERISTICS (25 Degrees C Ambient Temperature unless otherwise stated) SYM BV IR CHARACTERISTICS Breakdown Voltage Reverse Current (single device) Reverse Current (series connection) MIN 250 MAX UNITS V TEST CONDITIONS IR = VR = VR = VR = VR = IF = IF = IF = IF = 100 uA 200 V 200 V 400 V 400 V 100 mA 200 mA 100 mA 200 mA 100 100 100 100 1.00 1.25 2.00 2.50 50 nA uA nA uA V V V V nS TA = +150 Deg C TA = +150 Deg C VF Forward Voltage (single device) Forward Voltage (series connection) TRR Reverse Recovery Time IF = IR = 30 mA IRR = 3.0 mA RL = 100 ohms NOTES: 1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. 2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. 3. These ratings give a maximum junction temperature of 150 degrees C and junction-to-ambient thermal resistance of 357 degrees C per Watt. (Derating factor of 2.8 milliwatts per degree C) DISCRETE POWER AND SIGNAL TECHNOLOGIES 0.019 (0.483) 0.015 (0.381) 3 0.098 (2.489) 0.083 (2.108) 3 CHARACTERS MAX 0.055 (1.397) 0.047 (1.194) 1 2 0.024 (0.810) 0.018 (0.457) 0.040 (1.016) 0.035 (0.889) 0.080 (2.032) 0.070 (1.778) 0.120 (3.048) 0.110 (2.794) LOW PROFILE 0.041 (1.041) (49) 0.035 (0.889) LOW PROFILE 0.0040 (0.102) (49) 0.0005 (0.013) 0.0059 (0.150) 0.0035 (0.089) SOT-23 TO-236AB (LOW PROFILE) 22-August-1994 DISCRETE POWER AND SIGNAL TECHNOLOGIES 0.030" +/- 0.005" (0.762 +/- 0.127) 0.120" MINIMUM (3.048) 0.035" TYPICAL (0.889) 0.060" +/- 0.005" (1.524 +/- 0.127) RECOMMENDED SOLDER PADS FOR SOT-23 DISCRETE POWER AND SIGNAL TECHNOLOGIES 0.031" +/- 0.005" (0.800 +/- 0.127) 0.039" +/- 0.005" (1.000 +/- 0.127) 0.099" +/- 0.005" (2.524 +/- 0.127 ) 0.037" +/- 0.005" (0.950 +/- 0.127 ) 0.060" +/- 0.005" (1.524 +/- 0.127) RECOMMENDED SOLDER PADS FOR U.S. & European SOT-23 & Japanese SC-59 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 TinyLogicTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. |
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